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CHNCHIP ENGINEERING CO.,LTD.
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86-0756-8632035

珠海市中芯集成電路有限公司
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                                       Wafer grinding???????


?Service items : Grinding services for 4-12-inches wafer.

Production capacity: 20,000 wafers/month.

?Minimum thickness: 100um.

                          

                                        Wafer testing?


?Service items : Testing services for 4-12-inches wafer.


?Production capacity : 15,000 wafers/month.


?Chip type : analog chip/digital chip.?

                                   

                                         Dicing Saw         

         

?Service items : Dicing services for 4-12 inches wafer.


Production capacity : 10,000 dies/month.


Minimum dicing path : 50um.

                                       

                                        Wafer sorting


S?ervice items : Sorting service for 4-12 inches wafer.

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